Advanced MEMS Packaging

by C.S. Premachandran, Yu Aibin, Cheng Kuo Lee, et al.

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A comprehensive guide to 3D MEMS packaging methods and solutions

Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging...

• Format: Hardcover
• Language: English
• ISBN: 0071626239
• ISBN13: 9780071626231
• Release Date: November 2009
• Publisher: McGraw-Hill Companies
• Length: 576 Pages
• Weight: 2.20 lbs.
• Dimensions: 1.4" x 6.1" x 9.0"