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Wafer Bonding: Applications and Technology
By Ulrich Gösele and Marin Alexe
Edition Description
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based...
Edition Details
Format:Paperback
Language:English
ISBN:3642059155
Format: Paperback
Condition:
$
379.99
Wafer Bonding: Applications and Technology
By Ulrich Gösele and Marin Alexe
Edition Description
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based...
Edition Details
Format:Hardcover
Language:English
ISBN:3540210490
Format: Hardcover
Condition:
$
379.99
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