Wafer Bonding: Applications and Technology

By Ulrich Gösele and Marin Alexe

Book Overview

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

• Format: Paperback
• Language: English
• ISBN: 3642059155
• ISBN13: 9783642059155
• Release Date: September 2011
• Publisher: Springer
• Length: 504 Pages
• Weight: 1.60 lbs.
• Dimensions: 1.1" x 6.1" x 9.2"