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Three Dimensional System Integration: IC Stacki...
Edition Description
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer...
Edition Details
Format:Paperback
Language:English
ISBN:1489981829
Format: Paperback
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Three Dimensional System Integration: IC Stacki...
Edition Description
The next step in system integration: the benefits of going 3-D.- Process technology for manufacturing Through-Silicon Vias (TSVs).- Alternative 3D integration schemes.- Manufacturing issues in 3D stacked ICs.- TSV characterization.- Physical design of 3D stacked ICs.- DRAM on...
Edition Details
Format:Hardcover
Language:English
ISBN:1441909613
Format: Hardcover
Condition:
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60.10
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