Stress and Strain Engineering at Nanoscale in Semiconductor Devices

By Chinmay K Maiti

Book Overview

Based on 3D process and device simulations with mechanical stress simulations by finite element techniques, this book explains performance assessment of nanoscale devices with strained SiGe and other stressors. It explains the process-induced stress transfer and developments at 7nm technology and below node in the area of strain-engineered devices.

• Format: Hardcover
• Language: English
• ISBN: 0367519291
• ISBN13: 9780367519292
• Release Date: July 2021
• Publisher: CRC Press
• Length: 260 Pages
• Weight: 1.24 lbs.
• Dimensions: 0.7" x 6.1" x 9.2"