RF and Microwave Microelectronics Packaging II

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RF and Microwave Microelectronics Packaging II

Edition Description

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations,...

Edition Details

Format:Hardcover

Language:English

ISBN:3319516965

Format: Hardcover

Condition:

139.99

50 Available

Quantity:

RF and Microwave Microelectronics Packaging II

Edition Description

Edition Details

Format:Paperback

Language:English

ISBN:3319847198

Format: Paperback

Condition:

139.99

50 Available

Quantity:

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All Formats & Editions

RF and Microwave Microelectronics Packaging II

RF and Microwave Microelectronics Packaging II

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