RF and Microwave Microelectronics Packaging II

By: Kuang

Book Overview

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

• Format: Hardcover
• Language: English
• ISBN: 3319516965
• ISBN13: 9783319516967
• Release Date: March 2017
• Publisher: Springer
• Length: 172 Pages
• Weight: 0.97 lbs.
• Dimensions: 0.5" x 6.1" x 9.2"