MCM C/Mixed Technologies and Thick Film Sensors

By W.K. Jones

Book Overview

Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in... This description may be from another edition of this product.

• Format: Paperback
• Language: English
• ISBN: 9401040397
• ISBN13: 9789401040396
• Release Date: November 2012
• Publisher: Springer
• Length: 318 Pages
• Weight: 1.03 lbs.
• Dimensions: 0.7" x 6.1" x 9.2"