Flip Chip Technologies

By John H. Lau

Book Overview

'Flip Chip' has come to describe a group of related technologies that are used for connecting a chip to a substrate without the use of wires. Instead of using traditional wire leads, the chip is... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 0070366098
• ISBN13: 9780070366091
• Release Date: December 1995
• Publisher: McGraw-Hill Professional
• Length: 560 Pages
• Weight: 0.09 lbs.
• Dimensions: 8.8" x 1.4" x 6.2"