Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
$11.69
Electronic Packaging: Design, Materials, Process, and Reliability
$11.99
Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
$219.99
Solder Joint Reliability: Theory and applications
$219.99
Mechanics of Solder Alloy Interconnects (Electrical Engineering)
$32.89 - $219.99
Flip Chip Technologies
$6.89 - $7.89
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
Out of Stock
Ball Grid Array Technology
$7.79
Microvias: For Low Cost, High Density Interconnects
Out of Stock
Handbook Of Tape Automated Bonding
$16.09 - $219.99
Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials
Out of Stock
Handbook Of Fine Pitch Surface Mount Technology (Electrical Engineering)
$10.79 - $12.09
Chip Scale Package: Design, Materials, Process, Reliability, and Applications
$16.49
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
$146.00
Through-Silicon Vias for 3D Integration
$179.00
Advanced MEMS Packaging
Out of Stock
3D IC Integration and Packaging
$218.00
Heterogeneous Integrations
$169.99
Semiconductor Advanced Packaging
$119.99 - $179.99
Assembly and Reliability of Lead-Free Solder Joints
$129.99
Chiplet Design and Heterogeneous Integration Packaging
Out of Stock
