John H. Lau

Ball Grid Array Technology

John H. Lau

$49.39 - $56.49

Flip Chip Technologies

John H. Lau

$44.39 - $50.69

Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

John H. Lau

$53.39

Mechanics of Solder Alloy Interconnects (Electrical Engineering)

John H. Lau

$102.99 - $219.99

Microvias: For Low Cost, High Density Interconnects

John H. Lau

$53.09

Handbook Of Tape Automated Bonding

John H. Lau

$219.99

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

John H. Lau

$35.59

Electronic Packaging: Design, Materials, Process, and Reliability

John H. Lau

Out of Stock

Solder Joint Reliability: Theory and applications

John H. Lau

$20.99 - $219.99

Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)

John H. Lau

$39.09 - $219.99

Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials

John H. Lau

Out of Stock

Handbook Of Fine Pitch Surface Mount Technology (Electrical Engineering)

John H. Lau

Out of Stock

Chip Scale Package: Design, Materials, Process, Reliability, and Applications

John H. Lau

Out of Stock

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

John H. Lau

$141.98

Through-Silicon Vias for 3D Integration

John H. Lau

$179.00

Advanced MEMS Packaging

John H. Lau

Out of Stock

3D IC Integration and Packaging

John H. Lau

$229.00

Heterogeneous Integrations

John H. Lau

$179.99

Semiconductor Advanced Packaging

John H. Lau

$129.99 - $179.99

Assembly and Reliability of Lead-Free Solder Joints

John H. Lau

$129.99

Chiplet Design and Heterogeneous Integration Packaging

John H. Lau

Out of Stock