Electronics Packaging Forum: Volume Two

By James E. Morris

Book Overview

Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in... This description may be from another edition of this product.

• Format: Paperback
• Language: English
• ISBN: 9401066817
• ISBN13: 9789401066815
• Release Date: October 2011
• Publisher: Springer
• Length: 460 Pages
• Weight: 1.38 lbs.
• Dimensions: 0.9" x 6.0" x 9.0"