Characterization of Integrated Circuit Packaging Materials

by Robert McKenna and Thomas M. Moore

With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 1606501879
• ISBN13: 9781606501870
• Release Date: March 2010
• Publisher: Momentum Press
• Length: 274 Pages
• Weight: 1.28 lbs.
• Dimensions: 0.7" x 6.3" x 9.5"