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3D Microelectronic Packaging: From Architecture...
By Yan Li
Edition Description
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding...
Edition Details
Format:Hardcover
Language:English
ISBN:9811570892
Format: Hardcover
Condition:
$
199.99
3D Microelectronic Packaging: From Architecture...
By Yan Li
Edition Description
1. Introduction to 3D microelectronic packaging 2. 3D packaging architecture and assembly process design. 3. Fundamentals of TSV processing and reliability. 4. Mechanical properties of TSV. 5. Atomistic View of TSV Protrusion/Intrusion
Edition Details
Format:Paperback
Language:English
ISBN:9811570922
Format: Paperback
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