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IPC International
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Principles and Methods for Assessing Autoimmunity Associated with Exposure to Chemicals
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49.37
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Format: Paperback
Condition: New
Dermal Absorption (Environmental Health Criteria Series)
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39.30
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Transgenic Mutagenicity Assays (Environmental Health Criteria Series) (Environmental Health Criteria Series)
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48.19
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IPC: Code and Commentary 2015
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124.59
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IPC-J-STD-001HS-CN Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies
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IPC-A-610H Acceptability of Electronic Assemblies
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IPC-1782A-CN Standard for Manufacturing and Supply Chain Traceability of Electronic Products (Chinese)
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IPC J-STD-001H-KR Requirements for Soldered Electrical and Electronic Assemblies (Korean)
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IPC-7093A Design and Assembly Process Implementation for Bottom Termination (BTC) Components
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IPC-2231 DFX Guidelines (Chinese)
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IPC-2222B Sectional Design Standard for Rigid Organic Printed Boards
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IPC-2591-V1-2 Connected Factory Exchange (CFX)
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IPC-2551 International Standard for Digital Twins
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Elemental Speciation in Human Health Risk Assessment
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IPC J-STD-001HA/IPC-A-610HA-JP Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-a-610H Acceptability of Electronic Assemblies (Japanese)
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IPC J-STD-001HA/IPC-A-610HA-CN Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-a-610H Acceptability of Electronic Assemblies (Chinese)
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IPC-A-610G-R Rail Transit Addendum to IPC-a-610G Acceptability of Electronic Assemblies
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2021 International Plumbing Code (IPC) Quick-Card Based on 2021 IPC
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IPC/WHMA-A-620C-R Rail Applications Electronic Hardware Addendum to IPC/WHMA-a-620C
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IPC/WHMA-A-620C-R CN Rail Transit Addendum to IPC/WHMA-a-620C (Chinese)
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IPC-A-610G-R-CN Rail Transit Addendum to IPC-a-610G Acceptability of Electronic Assemblies (Chinese)
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IPC Checklist for Producing Printed Board Assemblies
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IPC J-STD-004C-CN Requirements for Soldering Fluxes (Chinese)
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IPC J-STD-004C WAM1 Requirements for Soldering Fluxes
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IPC-4922 Requirements for Sintering Materials for Reliable Electrical and Thermal Interconnects
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IPC-HDBK-9798 Handbook for Press-Fit Standard for Automotive Requirements and Other High-Reliability Applications
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IPC-6013E-CN Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards (Chinese)
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IPC-4202C Specification for Flexible Base Dielectrics for Use in Flexible Boards
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IPC-6013EM Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
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IPC a-610H-TH Acceptability of Electronic Assemblies (Thai)
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IPC-SM-817A-JP General Requirements for Dielectric Surface Mounting Adhesives (Japanese)
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IPC/WHMA-A-620D-VN Requirements and Acceptance for Cable and Wire Harness Assemblies (Vietnamese)
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IPC-9701B Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
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IPC-HDBK-001H-JP Handbook and Guide to Supplement J-STD-001 (Japanese)
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IPC-T-51, Terms and Definitions for the Design and Manufacture of Printed Electronics
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IPC-HERMES-9852, Version 1.4 the Global Standard for Machine-To-Machine Communication in SMT Assembly
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IPC-4552B-CN Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards (Chinese)
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IPC-7530A-JP Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave) (Japanese)
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IPC-A-640A Acceptance Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies
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IPC-D-620A Design and Critical Process Requirements for Cable and Wiring Harnesses
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IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
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IPC-7092A Design and Assembly Process Implementation for Embedded Circuitry
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IPC-2292A Design Standard for Printed Electronics on Flexible Substrates
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IPC-7801-JP Reflow Oven Process Control Standard (Japanese)
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IPC-6018DS Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
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IPC-7530A-JP Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave) (Japanese)
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IPC-6012E-AM1-CN Qualification and Performance Specification for Rigid Printed Boards (Chinese)
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IPC-D-640A Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies
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IPC-T-50N-CN Terms and Definitions for Interconnecting and Packaging Electronic Circuits (Chinese)
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