Wireless Interface Technologies for 3D IC and Module Integration

By Tadahiro Kuroda and Wai-Yeung Yip

Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 110884121X
• ISBN13: 9781108841214
• Release Date: September 2021
• Publisher: Cambridge University Press
• Length: 336 Pages
• Weight: 1.62 lbs.
• Dimensions: 0.8" x 6.7" x 9.6"