Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield

by George Harman

Book Overview

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.The Industry... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 0070326193
• ISBN13: 9780070326194
• Release Date: June 1997
• Publisher: McGraw-Hill Professional Publishing
• Length: 290 Pages
• Weight: 1.35 lbs.
• Dimensions: 0.8" x 6.3" x 9.2"

Customer Reviews

Interesting Read

If you need a fast way to get the basics of wirebonding, this book is a straight-forward, very readeable text. It references several papers if you want to read more on a particular section, but does a very good job summarizing available industry data.