In the present investigation a combination of two techniquest: a classic one for the deposition of ultra thin films (i.e., electroless deposition) and a complementary non-destructive (NDE) technique for quality evaluation of the deposited films have been used for nickel-cobalt ultra thin films. The present research project focuses on the application of a nondestructive method (i.e., scanning acoustic microscopy (SAM) to evaluate the quality of nickel cobalt ultra thin films grown on a dielectric substrate. The developed method is useful for further improvement of designing and manufacturing of the films. Visualizing micro cracks and delaminations provide information about adhesion within thin films system.
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