Tsv 3D RF Integration: High Resistivity Si Interposer Technology

By Yufeng Jin and Shenglin Ma

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters.

A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology.

• Format: Paperback
• Language: English
• ISBN: 0323996027
• ISBN13: 9780323996020
• Release Date: May 2022
• Publisher: Elsevier
• Length: 292 Pages
• Weight: 1.11 lbs.
• Dimensions: 0.6" x 7.5" x 9.3"