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Through Silicon Vias: Materials, Models, Design, and Performance
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Through Silicon Vias: Materials, Models, Design... 0367574543 Book Cover

Through Silicon Vias: Materials, Models, Design...

By , , , et al.
Edition Description

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials,...

Edition Details
Format:Paperback
Language:English
ISBN:0367574543
Format: Paperback
Condition:
$
64.99
50 Available
Through Silicon Vias: Materials, Models, Design... 1498745520 Book Cover

Through Silicon Vias: Materials, Models, Design...

By , , , et al.
Edition Details
Format:Hardcover
Language:English
ISBN:1498745520
Format: Hardcover
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