Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging

By Jong-Hoon Lee

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References

• Format: Paperback
• Language: English
• ISBN: 3031005759
• ISBN13: 9783031005756
• Release Date: December 2007
• Publisher: Springer
• Length: 108 Pages
• Weight: 0.48 lbs.
• Dimensions: 0.3" x 7.5" x 9.3"