Three-Dimensional Integrated Circuit Design: Eda, Design and Microarchitectures

Book Overview

3D Process Technology Considerations.- Thermal and Power Delivery Challenges in 3D ICs.- Thermal-Aware 3D Floorplan.- Thermal-Aware 3D Placement.- Thermal Via Insertion and Thermally Aware Routing in 3D ICs.- Three-Dimensional Microprocessor Design.- Three-Dimensional Network-on-Chip Architecture.- PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers.- System-Level 3D IC Cost Analysis and Design Exploration.

• Format: Hardcover
• Language: English
• ISBN: 1441907831
• ISBN13: 9781441907837
• Release Date: December 2009
• Publisher: Springer
• Length: 284 Pages
• Weight: 1.30 lbs.
• Dimensions: 0.7" x 6.1" x 9.2"