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Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging (Materials, Circuits and Devices)
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Thermomechanical Simulation Methodologies for A... B0DW7TLDN8 Book Cover

Thermomechanical Simulation Methodologies for A...

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Edition Description

Entering the post-Moore era, electronic packaging technology has played an increasingly important role in enabling the production of more powerful chips, but such technology faces significant thermomechanical challenges.

It's important to be able understand and predict...

Edition Details
Format:Hardcover
Language:English
ISBN:B0DW7TLDN8
Format: Hardcover
Condition:
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