Thermal Stress and Strain in Microelectronics Packaging

Book Overview

Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 0442010583
• ISBN13: 9780442010584
• Release Date: August 1993
• Publisher: Springer
• Length: 884 Pages
• Weight: 1.10 lbs.