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Hardcover Thermal Stress and Strain in Microelectronics Packaging Book

ISBN: 0442010583

ISBN13: 9780442010584

Thermal Stress and Strain in Microelectronics Packaging

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Format: Hardcover

Condition: Very Good

$14.19
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Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to... This description may be from another edition of this product.

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