Thermal Management of Electronic Components

By RAVI KANDASAMY

Thermal design in electronics cooling is to achieve effective heat removal to increase reliability and life of the components and systems. This book focuses on cooling of a Flip Chip (FC) package... This description may be from another edition of this product.

• Format: Paperback
• Language: English
• ISBN: 3838360877
• ISBN13: 9783838360874
• Release Date: May 2010
• Publisher: LAP Lambert Academic Publishing
• Length: 152 Pages
• Weight: 0.51 lbs.
• Dimensions: 0.3" x 6.0" x 9.0"