Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

By Juan Cepeda-Rizo, Jeremiah Gayle, Joshua Ravich

This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.

• Format: Paperback
• Language: English
• ISBN: 1032160853
• ISBN13: 9781032160856
• Release Date: August 2024
• Publisher: CRC Press
• Length: 290 Pages
• Weight: 0.95 lbs.
• Dimensions: 0.6" x 6.1" x 9.2"