The Elfnet Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

By Christian Zardini and Günter Grossmann

Book Overview

1. Deformation and Fatigue of Solders.- 2. Factors Affecting the Bulk Embrittlement of Pb-Free Solder Joints.- 3. Thermal Fatigue Analysis.- 4. Electrochemical Behavior of Solder Alloys.- 5. Void Formation by Kirkendall Effect in Solder Joints.- 6. Tin Whiskers.- 7. Electromigration in Solder Interconnects.- 8. Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold.- 9. Reliability of Electronic Assemblies under Mechanical Shock Loading.- 10. Impact of Humidity and Contamination on Surface Insulation Resistance and Electrochemical Migration.- 11. Lead Free and Other Process Effects on Conductive Anodic Filamentation (CAF) Resistance of Glass Reinforced Epoxy Laminates.- 12. PCB Delamination.- 13. Excessive Warpage of Large Packages during Reflow Soldering.- 14. Popcorn Cracking.- 15. Thermal Capability of Components.

• Format: Paperback
• Language: English
• ISBN: 1447158407
• ISBN13: 9781447158400
• Release Date: November 2014
• Publisher: Springer
• Length: 313 Pages
• Weight: 1.00 lbs.
• Dimensions: 0.7" x 6.1" x 9.2"