Testing of Interposer-Based 2.5d Integrated Circuits

by Krishnendu Chakrabarty and Ran Wang

Book Overview

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This...

• Format: Paperback
• Language: English
• ISBN: 3319854615
• ISBN13: 9783319854618
• Release Date: May 2018
• Publisher: Springer
• Length: 182 Pages
• Weight: 0.63 lbs.
• Dimensions: 0.4" x 6.1" x 9.2"