ISTFA 97: International Symposium for Testing & Failure Analysis, 23d, 1997

By Asm

Proceedings of the October 1997 symposium, of interest to engineers involved in testing and failure analysis of semiconductor devices. Contains sections on testing and signature analysis, techniques, micro-electric-mechanical systems, discretes, packaging/E-beam, FIB/E- beam, and case histories. Specific topics include gain reduction in silicon pho

• Format: Hardcover
• Language: English
• ISBN: 0871706199
• ISBN13: 9780871706195
• Release Date: January 1997
• Publisher: ASM International
• Length: 346 Pages
• Weight: 1.10 lbs.