Stress-Induced Phenomena in Metallization: Avs Series 13

By Che-Yu Li, Paul S. Ho, Paul Totta

From a September 1991 international workshop in Ithaca, New York, 18 papers address the growing concern over the impact of stress-induced voiding and related phenomena on reliability in very large scale integrated circuits, as the circuit features become ever smaller and challenge the capabilities o

• Format: Hardcover
• Language: English
• ISBN: 1563960826
• ISBN13: 9781563960826
• Release Date: March 1998
• Publisher: American Institute of Physics
• Length: 288 Pages
• Weight: 1.32 lbs.
• Dimensions: 0.8" x 6.5" x 9.5"