Stress-Induced Phenomena in Metallization: 11th International Workshop

By Shinichi Ogawa and Paul S. Ho

Understanding stress-related phenomena in new materials used for 3D integration and packaging, particularly using through silicon vias and microbumps, is critical for future microelectronic products.... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 0735408556
• ISBN13: 9780735408555
• Release Date: December 2010
• Publisher: American Institute of Physics
• Length: 257 Pages
• Weight: 1.19 lbs.
• Dimensions: 0.8" x 6.6" x 9.5"