Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

By Jennie S. Hwang

Book Overview

One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology.... This description may be from another edition of this product.

• Format: Paperback
• Language: English
• ISBN: 940116052X
• ISBN13: 9789401160520
• Release Date: February 2012
• Publisher: Springer
• Length: 456 Pages
• Weight: 1.41 lbs.
• Dimensions: 1.0" x 6.0" x 9.0"