Solder Joint Reliability Assessment: Finite Element Simulation Methodology

By Norhashimah M. Shaffiar, Mohd N. Tamin, Norhashimah M Shaffiar, et al.

Book Overview

Introduction.- Overview of the Simulation Methodology.- Requirements for Finite Element Simulation.- Mechanics of Solder Materials.- Application I: Solder Joint Reflow Process.- Application II: Solder Joints under Temperature and Mechanical Cycles.- Damage Mechanics-based Models.- Application III: Board-level Drop Test with BGA Package.- Fatigue Fracture Process of Solder Joints.- Closure.

• Format: Paperback
• Language: English
• ISBN: 3319343017
• ISBN13: 9783319343013
• Release Date: September 2016
• Publisher: Springer
• Length: 174 Pages
• Weight: 0.60 lbs.
• Dimensions: 0.4" x 6.1" x 9.2"