Solder Joint Reliability Assessment: Finite Element Simulation Methodology

By Norhashimah M. Shaffiar, Mohd N. Tamin, Norhashimah M Shaffiar, et al.

Book Overview

Introduction.- Overview of the Simulation Methodology.- Requirements for Finite Element Simulation.- Mechanics of Solder Materials.- Application I: Solder Joint Reflow Process.- Application II: Solder Joints under Temperature and Mechanical Cycles.- Damage Mechanics-based Models.- Application III: Board-level Drop Test with BGA Package.- Fatigue Fracture Process of Solder Joints.- Closure.

• Format: Hardcover
• Language: English
• ISBN: 3319000918
• ISBN13: 9783319000916
• Release Date: May 2014
• Publisher: Springer
• Length: 174 Pages
• Weight: 0.90 lbs.
• Dimensions: 0.6" x 6.0" x 9.2"