Silicon Wafer Bonding Technology for Vlsi and Mems Applications (Emis Processing Series, 1)

By S.S. Iyer

By bonding a thin wafer of active silicon to a thicker wafer via a layer of insulating oxide to form an SOI structure it is possible to substantially improve the performance and integration of... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 0852960395
• ISBN13: 9780852960394
• Release Date: May 2002
• Publisher: Inst of Engineering & Technology
• Length: 200 Pages
• Weight: 1.10 lbs.
• Dimensions: 10.0" x 0.8" x 7.5"