Semiconductor Packaging: Materials Interaction and Reliability

By Randy Hsiao-Yu Lo, Andrea Chen, Randy Hsiao Lo

Book Overview

This easy-to-read book enables a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

• Format: Paperback
• Language: English
• ISBN: 113807540X
• ISBN13: 9781138075405
• Release Date: April 2017
• Publisher: CRC Press
• Length: 216 Pages
• Weight: 0.69 lbs.
• Dimensions: 0.5" x 6.1" x 9.2"