Semiconductor package and method for manufacturing the same: United States Patent 9984950

By: Kim, Jun Chul

Disclosed is a semiconductor package including: a base substrate provided with at least one cavity and made of a metallic material; at least one semiconductor chip mounted in the cavity; and a heat dissipating member arranged in a gap between an inner surface of the cavity and the semiconductor chip.

• Format: Paperback
• Language: English
• ISBN: B08QX9147J
• ISBN13: 9798582905882
• Release Date: January 1
• Publisher: Independently Published
• Length: 26 Pages
• Weight: 0.19 lbs.
• Dimensions: 0.1" x 8.5" x 11.0"