Self-Organized 3D Integrated Optical Interconnects: with All-Photolithographic Heterogeneous Integration

By Tetsuzo Yoshimura

Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve "short line distances of the cm-mm order" and "large line counts of hundreds-thousands." This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules.

This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.

• Format: Hardcover
• Language: English
• ISBN: 9814877042
• ISBN13: 9789814877046
• Release Date: March 2021
• Publisher: Jenny Stanford Publishing
• Length: 364 Pages
• Weight: 1.49 lbs.
• Dimensions: 0.9" x 6.0" x 9.0"