RF and Microwave Microelectronics Packaging

Book Overview

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

• Format: Paperback
• Language: English
• ISBN: 1489983244
• ISBN13: 9781489983244
• Release Date: September 2014
• Publisher: Springer
• Length: 285 Pages
• Weight: 0.94 lbs.
• Dimensions: 0.6" x 6.1" x 9.2"