RF and Microwave Integrated Circuit Development: Technology, Packaging and Testing

By: unknown author

RF and Microwave Integrated Circuit Development bridges the gap between existing literature, which focus mainly on the 'front-end' part of a product development (system, architecture, design techniques), by providing the reader with an insight into the 'back-end' part of product development.

• Format: Paperback
• Language: English
• ISBN: 1119004586
• ISBN13: 9781119004585
• Release Date: August 2023
• Publisher: John Wiley & Sons Inc
• Weight: 1.11 lbs.
• Dimensions: 6.7" x 9.6"