Reliability Technology for Integrated Circuit Packaging

Bys: Zhou, Bin, En, Yunfei, Chen, Si

This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress. Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing. Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.

• Format: Hardcover
• Language: English
• ISBN: 981953884X
• ISBN13: 9789819538843
• Release Date: April 2026
• Publisher: Springer
• Length: 510 Pages
• Weight: 2.28 lbs.
• Dimensions: 1.1" x 6.5" x 9.3"