Reliability, Stress Analysis and Failure Prevention Issues in Adhesive and Bolted Connections: Presented at the 1999 Asme International Mechanical ... Engineers, Design Engineering Division))
Contains the 16 papers presented at the November 1999 symposium. The topics include temperature distribution in a VLSI chip due to dynamic power density, the strength of joints combining adhesives with bolts, optimization of adhesively bonded single lap joints by adhered notching, and estimation of
ThriftBooks sells millions of used books at the lowest
everyday prices. We personally assess every book's quality and offer rare, out-of-print treasures. We
deliver the joy of reading in recyclable packaging with free standard shipping on US orders over $15.
ThriftBooks.com. Read more. Spend less.