Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science

By George Harman

Hardcover Book - Wire Bonding in Microelectronics ISBN # 0-930815-25-4 This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 0930815254
• ISBN13: 9780930815257
• Release Date: January 1989
• Publisher: Intl Society of Hybrid
• Length: 202 Pages
• Weight: 0.66 lbs.
• Dimensions: 9.3" x 0.8" x 6.3"