Recent Progress in Lead-Free Solder Technology: Materials Development, Processing and Performances

Recent Studies in The Development of Ceramic Reinforced Lead-Free Composite Solder.- Development of Geopolymer Ceramic Reinforced Solder.- Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders.- Molecular Dynamic on the Nanoparticle Reinforcement into Lead-free Solder during Reflow Soldering Process.- Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics.- Advanced assembly of Miniaturized Surface Mount Technology Components using Nano-Reinforced Solder Paste.- Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi.- The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation & Experimental.- Flux Modification for Wettability and Reliability Improvement in Solder Joints.- Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints.- Significance of Interfacial Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint and Methods of IMC Layer Thickness Measurements.- The Effect of Laser Soldering onto Intermetallic Compound Formation and Growth.- Reliability Analysis on the Flexible Printed Circuit Board During Reflow Soldering.- Solder Paste's Rheology Data for Stencil Printing Numerical Investigations.- Tin Whiskers Growth in Electronic Assemblies

• Format: Hardcover
• Language: English
• ISBN: 3030934403
• ISBN13: 9783030934408
• Release Date: March 2022
• Publisher: Springer
• Length: 328 Pages
• Weight: 1.44 lbs.
• Dimensions: 0.8" x 6.1" x 9.2"