1995 Proceedings: Seventh Annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA (INTERNATIONAL CONFERENCE ON WAFER SCALE INTEGRATION//PROCEEDINGS)

By IEEE Components Packaging & Manufacturing Technology Society

No Synopsis Available.

• Format: Hardcover
• Language: English
• ISBN: 0780324668
• ISBN13: 9780780324664
• Release Date: January 1995
• Publisher: IEEE
• Length: 392 Pages
• Weight: 1.55 lbs.
• Dimensions: 9.5" x 1.0" x 6.5"