Pick-up Process Analysis of a Die Bonder

By Sheng-Jye Hwang and Yeong-Jyh Lin

The gallium arsenide (GaAs) circuits in advanced communication application have been considered to profoundly supersede the conventional silicon-based counterpart. Great improvements in the packaging... This description may be from another edition of this product.

• Format: Paperback
• Language: English
• ISBN: 363900034X
• ISBN13: 9783639000344
• Release Date: April 2008
• Publisher: VDM Verlag Dr. Mueller E.K.
• Length: 136 Pages
• Weight: 0.42 lbs.
• Dimensions: 0.3" x 6.0" x 9.0"