Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces

By Nicole Lindenmann

To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.

This work was published by Saint Philip Street Press pursuant to a Creative Commons license permitting commercial use. All rights not granted by the work's license are retained by the author or authors.

• Format: Paperback
• Language: English
• ISBN: 1013279042
• ISBN13: 9781013279041
• Release Date: October 2020
• Publisher: Saint Philip Street Press
• Length: 254 Pages
• Weight: 1.31 lbs.
• Dimensions: 0.5" x 8.5" x 11.0"