Packaging of High Power Semiconductor Lasers

By Lingling Xiong, Hui Liu, Wei Zhao, et al.

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and... This description may be from another edition of this product.

• Format: Paperback
• Language: English
• ISBN: 149395590X
• ISBN13: 9781493955909
• Release Date: October 2016
• Publisher: Springer
• Length: 402 Pages