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Ocena wydajnosci architektury 3D SRAM z wykorzystaniem wspólosiowych TSV
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Ocena wydajnosci architektury 3D SRAM z wykorzy... [Polish] 6209279120 Book Cover

Ocena wydajnosci architektury 3D SRAM z wykorzy... [Polish]

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Edition Description

Ukladanie w stosy urządzeń logicznych i pamięciowych w technologii 3D ma zasadnicze znaczenie dla utrzymania tempa rozwoju zgodnie z prawem Moore'a. W integracji 3D urządzenia pamięciowe mogą byc ukladane w stosy na procesorach. Architektura pamięci...

Edition Details
Format:Paperback
Language:Polish
ISBN:6209279120
Format: Paperback
Condition:
$
52.79
50 Available
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