Skip to content
Scan a barcode
Scan
Paperback New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation Book

ISBN: 1627058540

ISBN13: 9781627058544

New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology... This description may be from another edition of this product.

Recommended

Format: Paperback

Temporarily Unavailable

We receive fewer than 1 copy every 6 months.

Related Subjects

Engineering Technology

Customer Reviews

0 rating
Copyright © 2026 Thriftbooks.com Terms of Use | Privacy Policy | Do Not Sell/Share My Personal Information | Cookie Policy | Cookie Preferences | Accessibility Statement
ThriftBooks® and the ThriftBooks® logo are registered trademarks of Thrift Books Global, LLC
GoDaddy Verified and Secured