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New Prospects of Integrating Low Substrate Temp... 3031008995 Book Cover

New Prospects of Integrating Low Substrate Temp...

Edition Description

In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (

Edition Details
Format:Paperback
Language:English
ISBN:3031008995
Format: Paperback
Condition:
$
44.14
50 Available
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